Controlled electroplating and electromigration in nickel electrodes for nanogap formation

Luis De Los Santos Valladares, Lizbet Leon Felix, Angel Bustamante Dominguez, Thanos Mitrelias, Francois Sfigakis, Saiful I. Khondaker, Crispin H.W. Barnes, Yutaka Majima

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Abstract

We report the fabrication of nickel nanospaced electrodes by electroplating and electromigration for nanoelectronic devices. Using a conventional electrochemical cell, nanogaps can be obtained by controlling the plating time alone and after a careful optimization of electrodeposition parameters such as electrolyte bath, applied potential, cleaning, etc. During the process, the gap width decreases exponentially with time until the electrode gaps are completely bridged. Once the bridge is formed, the ex situ electromigration technique can reopen the nanogap. When the gap is ∼1 nm, tunneling current-voltage characterization shows asymmetry which can be corrected by an external magnetic field. This suggests that charge transfer in the nickel electrodes depends on the orientation of magnetic moments. © 2010 IOP Publishing Ltd.
Original languageAmerican English
JournalNanotechnology
DOIs
StatePublished - 5 Nov 2010

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    De Los Santos Valladares, L., Felix, L. L., Dominguez, A. B., Mitrelias, T., Sfigakis, F., Khondaker, S. I., Barnes, C. H. W., & Majima, Y. (2010). Controlled electroplating and electromigration in nickel electrodes for nanogap formation. Nanotechnology. https://doi.org/10.1088/0957-4484/21/44/445304