Modeling and Simulation of FBG Based Pressure Sensor for Micro Level Strain Measurement

M. A. Ibrar Jahan; Ciro Rodriguez Rodriguez; Rajini V. Honnungar

doi:10.1109/CONECCT55679.2022.9865822

Modeling and Simulation of FBG Based Pressure Sensor for Micro Level Strain Measurement

M. A. Ibrar Jahan, Ciro Rodriguez Rodriguez, Rajini V. Honnungar

Producción científica: Capítulo del libro/informe/acta de congreso › Contribución a la conferencia › revisión exhaustiva

Resumen

This article presents the modeling and simulation of Silica and PMMA (Polymethyl methacrylate) Fiber Bragg Grating (FBG) based pressure sensors for micro-level strain (μϵ) measurement. Modeling is performed to show that the reflectivity is dependent on grating length. Grating length is varied between 1mm to 10mm and beyond 6mm of grating length maximum reflectivity is obtained. Further, two different types of FBG sensors like Silica and PMMA are designed and simulated as pressure sensors on the R-Soft Grating Mod tool. The designed sensors can detect pressure ranging from 3 kPa to 11 kPa. Achieved a strain sensitivity of 1.29 pm/μϵ for Silica FBG and 1.39 pm/μϵ for PMMA FBG. Such a type of low pressure sensing sensor can be used in fiber-reinforced polymer laminates, automobiles, aerospace, and harsh environment to measure the strain.

Idioma original	Inglés
Título de la publicación alojada	2022 IEEE International Conference on Electronics, Computing and Communication Technologies, CONECCT 2022
Editorial	Institute of Electrical and Electronics Engineers Inc.
ISBN (versión digital)	9781665497817
DOI	https://doi.org/10.1109/CONECCT55679.2022.9865822
Estado	Publicada - 2022
Evento	2022 IEEE International Conference on Electronics, Computing and Communication Technologies, CONECCT 2022 - Bangalore, India Duración: 8 jul. 2022 → 10 jul. 2022

Serie de la publicación

Nombre	2022 IEEE International Conference on Electronics, Computing and Communication Technologies, CONECCT 2022

Conferencia

Conferencia	2022 IEEE International Conference on Electronics, Computing and Communication Technologies, CONECCT 2022
País/Territorio	India
Ciudad	Bangalore
Período	8/07/22 → 10/07/22

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© 2022 IEEE.

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10.1109/CONECCT55679.2022.9865822

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Ibrar Jahan, M. A., Rodriguez Rodriguez, C., & Honnungar, R. V. (2022). Modeling and Simulation of FBG Based Pressure Sensor for Micro Level Strain Measurement. En 2022 IEEE International Conference on Electronics, Computing and Communication Technologies, CONECCT 2022 (2022 IEEE International Conference on Electronics, Computing and Communication Technologies, CONECCT 2022). Institute of Electrical and Electronics Engineers Inc.. https://doi.org/10.1109/CONECCT55679.2022.9865822

Ibrar Jahan, M. A. ; Rodriguez Rodriguez, Ciro ; Honnungar, Rajini V. / Modeling and Simulation of FBG Based Pressure Sensor for Micro Level Strain Measurement. 2022 IEEE International Conference on Electronics, Computing and Communication Technologies, CONECCT 2022. Institute of Electrical and Electronics Engineers Inc., 2022. (2022 IEEE International Conference on Electronics, Computing and Communication Technologies, CONECCT 2022).

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title = "Modeling and Simulation of FBG Based Pressure Sensor for Micro Level Strain Measurement",

abstract = "This article presents the modeling and simulation of Silica and PMMA (Polymethyl methacrylate) Fiber Bragg Grating (FBG) based pressure sensors for micro-level strain (μϵ) measurement. Modeling is performed to show that the reflectivity is dependent on grating length. Grating length is varied between 1mm to 10mm and beyond 6mm of grating length maximum reflectivity is obtained. Further, two different types of FBG sensors like Silica and PMMA are designed and simulated as pressure sensors on the R-Soft Grating Mod tool. The designed sensors can detect pressure ranging from 3 kPa to 11 kPa. Achieved a strain sensitivity of 1.29 pm/μϵ for Silica FBG and 1.39 pm/μϵ for PMMA FBG. Such a type of low pressure sensing sensor can be used in fiber-reinforced polymer laminates, automobiles, aerospace, and harsh environment to measure the strain.",

keywords = "Bragg, FBG, PMMA, Silica, Wavelength Sensitivity",

author = "{Ibrar Jahan}, {M. A.} and {Rodriguez Rodriguez}, Ciro and Honnungar, {Rajini V.}",

note = "Publisher Copyright: {\textcopyright} 2022 IEEE.; 2022 IEEE International Conference on Electronics, Computing and Communication Technologies, CONECCT 2022 ; Conference date: 08-07-2022 Through 10-07-2022",

year = "2022",

doi = "10.1109/CONECCT55679.2022.9865822",

language = "Ingl{\'e}s",

series = "2022 IEEE International Conference on Electronics, Computing and Communication Technologies, CONECCT 2022",

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Ibrar Jahan, MA, Rodriguez Rodriguez, C & Honnungar, RV 2022, Modeling and Simulation of FBG Based Pressure Sensor for Micro Level Strain Measurement. En 2022 IEEE International Conference on Electronics, Computing and Communication Technologies, CONECCT 2022. 2022 IEEE International Conference on Electronics, Computing and Communication Technologies, CONECCT 2022, Institute of Electrical and Electronics Engineers Inc., 2022 IEEE International Conference on Electronics, Computing and Communication Technologies, CONECCT 2022, Bangalore, India, 8/07/22. https://doi.org/10.1109/CONECCT55679.2022.9865822

Modeling and Simulation of FBG Based Pressure Sensor for Micro Level Strain Measurement. / Ibrar Jahan, M. A.; Rodriguez Rodriguez, Ciro; Honnungar, Rajini V.
2022 IEEE International Conference on Electronics, Computing and Communication Technologies, CONECCT 2022. Institute of Electrical and Electronics Engineers Inc., 2022. (2022 IEEE International Conference on Electronics, Computing and Communication Technologies, CONECCT 2022).

Producción científica: Capítulo del libro/informe/acta de congreso › Contribución a la conferencia › revisión exhaustiva

TY - GEN

T1 - Modeling and Simulation of FBG Based Pressure Sensor for Micro Level Strain Measurement

AU - Ibrar Jahan, M. A.

AU - Rodriguez Rodriguez, Ciro

AU - Honnungar, Rajini V.

PY - 2022

Y1 - 2022

N2 - This article presents the modeling and simulation of Silica and PMMA (Polymethyl methacrylate) Fiber Bragg Grating (FBG) based pressure sensors for micro-level strain (μϵ) measurement. Modeling is performed to show that the reflectivity is dependent on grating length. Grating length is varied between 1mm to 10mm and beyond 6mm of grating length maximum reflectivity is obtained. Further, two different types of FBG sensors like Silica and PMMA are designed and simulated as pressure sensors on the R-Soft Grating Mod tool. The designed sensors can detect pressure ranging from 3 kPa to 11 kPa. Achieved a strain sensitivity of 1.29 pm/μϵ for Silica FBG and 1.39 pm/μϵ for PMMA FBG. Such a type of low pressure sensing sensor can be used in fiber-reinforced polymer laminates, automobiles, aerospace, and harsh environment to measure the strain.

AB - This article presents the modeling and simulation of Silica and PMMA (Polymethyl methacrylate) Fiber Bragg Grating (FBG) based pressure sensors for micro-level strain (μϵ) measurement. Modeling is performed to show that the reflectivity is dependent on grating length. Grating length is varied between 1mm to 10mm and beyond 6mm of grating length maximum reflectivity is obtained. Further, two different types of FBG sensors like Silica and PMMA are designed and simulated as pressure sensors on the R-Soft Grating Mod tool. The designed sensors can detect pressure ranging from 3 kPa to 11 kPa. Achieved a strain sensitivity of 1.29 pm/μϵ for Silica FBG and 1.39 pm/μϵ for PMMA FBG. Such a type of low pressure sensing sensor can be used in fiber-reinforced polymer laminates, automobiles, aerospace, and harsh environment to measure the strain.

KW - Bragg

KW - FBG

KW - PMMA

KW - Silica

KW - Wavelength Sensitivity

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M3 - Contribución a la conferencia

AN - SCOPUS:85138263698

T3 - 2022 IEEE International Conference on Electronics, Computing and Communication Technologies, CONECCT 2022

BT - 2022 IEEE International Conference on Electronics, Computing and Communication Technologies, CONECCT 2022

PB - Institute of Electrical and Electronics Engineers Inc.

T2 - 2022 IEEE International Conference on Electronics, Computing and Communication Technologies, CONECCT 2022

Y2 - 8 July 2022 through 10 July 2022

ER -

Ibrar Jahan MA, Rodriguez Rodriguez C, Honnungar RV. Modeling and Simulation of FBG Based Pressure Sensor for Micro Level Strain Measurement. En 2022 IEEE International Conference on Electronics, Computing and Communication Technologies, CONECCT 2022. Institute of Electrical and Electronics Engineers Inc. 2022. (2022 IEEE International Conference on Electronics, Computing and Communication Technologies, CONECCT 2022). doi: 10.1109/CONECCT55679.2022.9865822

Modeling and Simulation of FBG Based Pressure Sensor for Micro Level Strain Measurement

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